Gallium
nitride is becoming increasing popular as a replacement to silicon for many
applications in different markets: opto-electronics such as LEDs, ICT and power
electronics among others.
One of the
major areas where GaN is already today utilized with success is the market of opto-electronics
and LEDs.
LEDs (or
light emitting diodes) are semiconductor-based devices that are slowly but
steadily replacing the traditional incandescent bulbs in applications such as
indoor and outdoor illumination, TV screens and monitors (also using OLEDs, or
organic light emitting diodes, and other kinds of LEDs) among others due to
their lower power utilization and to their high lifetime which comes from the
advantage that they do not need to be replaced due to filament burn out and
other problems typical of traditional incandescent light bulbs.
Currently,
GaN is deposited over patterned sapphire substrates (also known as PSSs) to
improve the efficiency and light output, but recent research seems to point to
an improvement in the overall conditions by deposition of a thin film of GaN
directly on silicon substrates therefore reducing the costs of production,
since silicon is a material already widely used in electronics and therefore
production and patterning of silicon wafers does not require to buy new equipment
and tools.
The main
advantage of GaN-deposited substrates compared with traditional non-sputtered
LEDs is higher brightness.
Besides the
LED and opto-electronics industry, another major application of GaN-deposited
substrates is in the power electronics, mainly in the automobile industry and
in the aerospace and satellite industries.
GaN-deposited
substrates are already commonly used in applications such as power amplifiers, power
supply units, rectifiers, switchers, inverters RF devices and are quickly replacing
traditional silicon-based devices such as FETs, HEMTs, Schotty diodes among
others due to much higher breakdown voltage, higher conductivity and larger
band gap therefore offering improved performance and better reliability.
HEMT is a
kind of power IC which is crucial in many applications in the aerospace and
other businesses.
HEMT is a
type of field-effect transistor device which is focused on high-frequency tasks
and usage of GaN leads to a higher electron mobility and breakdown voltage if
compared with traditional materials such as silicon and gallium arsenide
Finally, other
applications of GaN-based devices are in the automotive sector and in the solar
market: hybrid and electric vehicles make heavy use of GaN-powered technology.
In the
solar and other renewables market (mainly wind), the most popular and widely
used GaN-based devices are: Smart Grid Power Devices, High-Voltage Direct
Current (HVDC) units, power systems for wind turbines and solar grids among
others
Finally, in
the communication industry GaN-based devices are found in radars, satellite
communication systems, mainly due to the possibility to work at high-frequency
ranges
From the
consumer and from the final user point of view, GaN-powered devices are more
compact and more resistant to shocks than their silicon-based counterparts.
As of
today, GaN-based power semiconductors account for about 1% of the total market
(currently valued at around $40 billion) but they are growing very fast and
they are expected to take a larger share of the business within 5 to 10 years potentially
supplanting their traditional silicon-based counterparts in the long term.
About the Author-
This article was written
by Matteo
Martini, author and CEO of Martini Tech, a company that provides
nanoimprint, PSS patterning, MOCVD deposition, sputtering, MEMS foundry, GaN
wafer, GaN LED
Technology and other microfabrication-related services. Please have a look
at our blog.
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